Innodisk Launches AI on Dragonwing Computing Series with 100 TOPS Performance
Innodisk has announced its new AI on Dragonwing computing series, developed in collaboration with Qualcomm Technologies, featuring the first EXMP-Q911 COM-HPC mini module. The module delivers 100 trillion operations per second (TOPS) AI performance while maintaining power efficiency and operating reliability across temperatures from -40°C to 85°C.
EXMP-Q911 Module Specifications and Performance
The flagship COM-HPC mini module EXMP-Q911 is powered by the Qualcomm Dragonwing™ IQ-9075 processor, featuring an 8-core Kryo 6th generation CPU and Adreno 663 GPU. Based on specific test scenarios, the EXMP-Q911 can achieve AI frame rates up to 10 times higher than comparable modules.
The module integrates 36GB LPDDR5X memory and 128GB UFS 3.1 storage, alongside comprehensive interfaces including PCIe Gen4, USB 3.2, dual 2.5-gigabit LAN ports, dual DP1.2 ports, MIPI CSI-2, CAN FD, and others for robust connectivity in high-performance embedded edge systems.
Software Tools and Development Platform
Beyond hardware performance, Innodisk enhances its solutions with advanced software tools, notably IQ Studio – an open-source developer portal on GitHub providing board support packages (BSPs), reference codes, benchmarking tools, and interactive developer spaces. The iCAP cloud-based management platform enables remote device and AI model management across distributed edge environments.
The module works optimally when paired with Innodisk’s carrier boards and pre-validated peripherals, including integrated MIPI and GMSL cameras with fully configured drivers for vision language models (VLM) and computer vision AI, alongside modular M.2 expansion cards for networking, storage, and industrial I/O.
With Innodisk’s new AI on Dragonwing series, we’re making advanced edge intelligence more accessible and scalable for industrial customers.
Anand Venkatesan, Senior Director of Product Management and Head of Industrial Processors at Qualcomm Technologies
Long-term Support and Future Expansion
Qualcomm Dragonwing™ SoCs provide long-term support until 2038, ensuring supply stability for long-term industrial applications. As the first product line within Innodisk’s ARM-based AI portfolio, this series opens new possibilities for customers seeking sustainable and scalable ARM-based edge AI solutions.
Looking ahead, Innodisk and Qualcomm Technologies will enhance collaboration through reference designs, trial kits, and go-to-market initiatives. The product portfolio will include Qualcomm Dragonwing™ IQX and IQ8 SoCs, plus future ARM architecture platforms for industrial automation, defect detection, AGV/AMR, smart cities, and diverse vertical markets.
