GIGABYTE Introduces AI-Powered X3D Turbo Mode 2.0 for AMD Ryzen 9000 Processors at CES 2026
At CES 2026, GIGABYTE unveiled its exclusive X3D Turbo Mode 2.0 technology, designed to unlock the full potential of AMD Ryzen 9000 Series Processors with AMD 3D V-Cache technology. This AI-powered solution delivers real-time, adaptive performance tuning that pushes X3D CPUs beyond traditional operational limits through advanced hardware-software integration.
Flagship X870E AORUS XTREME X3D AI TOP Performance
The flagship X870E AORUS XTREME X3D AI TOP motherboard showcases GIGABYTE’s commitment to high-performance computing. The board supports DDR5 speeds up to 9000+ MT/s, providing exceptional memory bandwidth and stability for demanding applications.
GIGABYTE’s advanced thermal architecture includes the CPU Thermal Matrix system, which reduces VRM and DDR temperatures by up to 8.5°C. The DDR Wind Blade XTREME cooling solution further lowers module temperatures by up to 9°C, while the M.2 Thermal Guard XTREME reduces SSD temperatures by up to 22°C for sustained performance.
Expanded Motherboard Lineup with Design Focus
Beyond performance, GIGABYTE introduced design-forward options including the X870E AERO X3D WOOD model, featuring wood-grain textures and leather pull tabs for a natural aesthetic. The company also expanded its PROJECT STEALTH series with sleek black X870 and B850 AORUS STEALTH motherboards.
The PROJECT STEALTH series adopts a reverse-connector layout that provides a clean, cableless visual appearance and simplified assembly experience, giving builders greater flexibility in system design and cable management.
CES 2026 Exhibition Details
Attendees can experience GIGABYTE’s complete product lineup at Booth #8519 in LVCC North Hall during CES 2026. Media and VIP sessions are scheduled at Venetian Ballroom Level 3 in rooms Lido 3004, 3005, and 3104, offering hands-on demonstrations of the X3D Turbo Mode 2.0 technology and new motherboard designs.
